MTTB60118 — 30–520 MHz Tunable Bandpass Filter (10 mm)

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MTT® · RF & MICROWAVE COMPONENTS · MTTB60118

30–520 MHz Tunable Bandpass Filter
10 mm SMT Package

Compact, frequency-agile VHF/UHF RF filtering with SPI digital control, 5 dB typical insertion loss and +45 dBm typical IIP3.

30–520 MHzFrequency range
5.0 dBTypical insertion loss
20 µsTypical tuning speed
+33 dBmTypical P1dB; not continuous rating

Product overview

Engineered for agile VHF/UHF RF chains

MTTB60118 is a digitally tunable 30–520 MHz bandpass filter in a 10 mm-high surface-mount package. The source identifies uses in tactical radios, transmit paths and receiver chains.

Size: 22.1 × 22.1 × 10 mm · Supply: 3.3 V nominal · SPI: 16-bit tuning interface.

Important RF power interpretation

+33 dBm typical P1dB is a 1 dB compression point, not automatically a continuous 2 W input-power rating. Power handling and switching conditions should be confirmed for the intended application.

Out-of-band limit: +37 dBm maximum stated in source.

Complete electrical and RF specifications

ParameterMinTypicalMax / note
Tunable frequency30 MHz—520 MHz
3 dB bandwidth4%5.0%6%
Rejection at f₀ ±10%—-26 dB—
Rejection at f₀ ±15%—-32 dB—
Rejection at f₀ ±20%—-36 dB—
Insertion loss—5.0 dB—
RF impedance—50 Ω—
Typical tune speed—20 µs30 µs max.
P1dB+30 dBm+33 dBm+35 dBm
Out-of-band power——+37 dBm
IIP3 (+18 dBm two-tone, ±5 kHz)—+45 dBm—
Noise figure—IL + 0.5 dBIL + 5 dB
Wideband noise—-174 dBm/Hz—
Supply voltage3.0 V3.3 V3.6 V
DC current—15 mA20 mA
Operating temperature−40°C—+75°C
Control—16-bit SPI serial—
C tuning option—125 kHz nominal (variable step by band)—
D tuning option—1 MHz—
Package dimensions—22.1 × 22.1 × 10 mm—

Values transcribed from the 10 mm model source (p.2). Refer to original measurement definitions and option codes; unspecified values are intentionally not inferred.

Functional block and RF signal routing

The source functional diagram shows RF input/output, three selected tunable filter paths and associated control/power pads. Preserve the model-specific 23-pin configuration in PCB designs.

Tuning modes, addressing and bypass

C option: fine addressing

The source calls this the “125 kHz tuning step” option, with step sizes that change across the band.

Address intervalFrequency intervalStep
240–51130–63.875 MHz125 kHz
512–102264–127.750 MHz250 kHz
1024–2044128–255.500 MHz500 kHz
2048–4160256–520 MHz1 MHz

D option: 1 MHz addressing

Decimal addresses 30 through 520 select frequencies from 30 MHz to 520 MHz in 1 MHz increments. The device begins tuning when the sixteenth SCLK data pulse is clocked while CS is low.

Bypass command: 0xFF00 as stated in the source; resume normal operation by sending a valid tuning address. Confirm the option before deploying this command.

The original source includes address discontinuities and defines unused channels only by implication. Do not generate unsupported addresses.

SPI timing and serial behaviour

Data is clocked on the leading SCLK edge. The source describes TUNE_READY as low while the module processes a new tuning address. For the specific min/max entries and waveforms, use the timing diagram below.

SymbolDefinitionSource rating
tSSMOSI setup to SCLK50 ns min.
tuMOSI hold after SCLK0 ns max. as tabulated
tCHClock high time125 ns min.
tCPClock period250 ns min.
tCSChip-select setup to SCLK125 ns min.
tTRTune Ready indicator30 µs max.
tACCAccess time, final SCLK to RF frequency30 µs max.
tHOPFrequency-to-frequency tune rate (D-option)11 kHz max. as source states

Mechanical outline, PCB land pattern and pinout

Mechanical envelope: 22.1 mm × 22.1 mm × 10 mm. Preserve pin-1 orientation, castellation geometry and solder land dimensions from the model-specific drawing.

PinSignal / label
1GND
2N/C
3N/C
4GND
5RF_IN
6GND
7TUNE_READY
8N/C
9N/C
10N/C
11SD0
12GND
13+3.3V
14SCLK
15MOSI
16GND
17RF_OUT
18GND
19CS
20N/C
21GND
22GND
23GND

Pin 11 is labelled SD0 in this model’s source. The 5 mm and 10 mm PDFs show “SD0”, while the 7 mm PDF shows “SDO”. Confirm the intended designation before PCB release.

Environment, compliance and handling

ItemSource specification / instruction
Operating temperature−40 to +75°C in electrical table (p.2)
MIL-STD-810E high temperature75°C high-temperature operation in environmental table (source p.6).
MIL-STD-810E storage high125°C, Method 501.3, Procedure I
MIL-STD-810E storage low−57°C, Method 502.3, Procedure I
VibrationMIL-STD-810E, Method 514.4
ShockMIL-STD-810E, Method 516.4, Procedure VI
RoHSSource states compliant
PlatingElectroless nickel 100 µin minimum; immersion gold 2–6 µin on outer layers
Moisture sensitivityMSL 3
CleaningODC-compatible solvents; avoid methylene chloride/epoxy solvents; no ultrasonic cleaning; keep dry before assembly

The source wording includes a legacy reference to “Netcom” in the cleaning guidance. This is not presented here as an MTT certification or independent test evidence.

Solder reflow and assembly guidance

The supplied PDF provides separate SnPb and Pb-free soldering windows. Actual reflow characteristics depend on PCB thickness, paste, thermal mass and neighbouring devices. Temperatures are specified at the PCB interface.

ParameterSnPbPb-free
Ramp-up3°C/s max.3°C/s max.
Preheat TSMIN100°C150°C
Preheat TSMAX150°C200°C
Preheat time60–120 s60–120 s
Solder melting point183°C217°C
Peak temperature225°C245°C
Time above liquidus45–90 s45–70 s
Within 5°C peak30 s max.30 s max.
Ramp-down6°C/s max.6°C/s max.
25°C to peak4.5 min max.5 min max.

Request the complete 10 mm datasheet

Send the MTT technical team an enquiry for MTTB60118 — 30–520 MHz Tunable Bandpass Filter (10 mm).

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MTT® · www.mttinnovation.com · sales@mttinnovation.com

Technical information is derived from the supplied MTTB60118 source PDF; specifications are subject to change. This page does not imply confirmed interchangeability with other manufacturers' filters.